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感谢本站网友 風見暉一 的线索投递!
本站 3 月 23 日消息,苹果供应链分析师郭明錤昨日重申,iPhone 18 系列中的 A20 芯片将采用台积电的 2nm 工艺进行制造。
郭明錤还表示,台积电 2nm 芯片的研发试产良率在 3 个多月前就已高于 60%-70%,现在则已远高于这个范围。良率是指每片硅晶圆中能够获得的功能性芯片的百分比,而硅晶圆本质上是一个大的圆形芯片盘。
郭明錤早在六个月前就曾预测 A20 芯片将采用 2nm 工艺,而另一位分析师 Jeff Pu 也在本周早些时候表达了相同的观点。此前曾有传言称 A20 芯片将维持 3nm 工艺,但该说法已被撤回。
A20 芯片采用 2nm 工艺而非 3nm 工艺,意味着其相比 iPhone 17 系列的 A19 芯片,在性能和能效方面将有更显著的提升。郭明錤、Jeff Pu 等分析师均表示,A19 芯片将采用台积电第三代 3nm 工艺(N3P)制造。
从 3nm 工艺升级到 2nm 工艺,可以让每颗芯片容纳更多的晶体管,从而提升性能。据相关报道,A20 芯片预计将比 A19 芯片快 15%,并且能效提升高达 30%。
以下是目前和预期芯片的概览:
A17 Pro 芯片:3nm(台积电第一代 3nm 工艺 N3B)
A18 和 A18 Pro 芯片:3nm(台积电第二代 3nm 工艺 N3E)
A19 和 A19 Pro 芯片:3nm(台积电第三代 3nm 工艺 N3P)
A20 和 A20 Pro 芯片:2nm(台积电第一代 2nm 工艺 N2)
本站需要指出的是,这些纳米尺寸仅仅是台积电的营销术语,并非实际测量值。
iPhone 18 系列距离发布仍有大约一年半的时间。